Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2013
ISSN: 2156-3950,2156-3985
DOI: 10.1109/tcpmt.2012.2228004